Versatile CO₂ laser-based sub-system — providing 180 W, 250 W or 450 W for precision drilling, cutting, marking, and engraving of many non-metals, including glass, organic materials.
The combination of a fast scanner head, high laser power, and excellent beam quality enables high processing speeds with PowerLine C. StarFlex software simplifies complex operations and makes PowerLine C easy to integrate into other production tools.
The Coherent PowerLine C sub-system integrates a Diamond J-series CO2 laser providing an extensive range of micro material processing applications, like free contour shaping, text or surface structuring of polymers, glass, paper, or natural materials such as leather, vulcanized rubber, or wood. The wide spectrum of laser powers together with excellent beam quality and scanner deflection head technology allows numerous different kinds of material processing in one system: drilling, cutting, scribing, structuring, or engraving. High processing speeds can be achieved due to the fast scanner heads, high laser power of up to 450 W, and powerful, process enabling control software. Even most complex on-the-fly applications can be achieved in short processing times with excellent quality.
Product Specifications
